ASML Holding NV Earnings - Q1 2026 Analysis & Highlights

ASML Holding NV reported strong Q1 2026 results driven by exceptional demand for advanced lithography equipment, particularly EUV systems for AI-related infrastructure investments, with management raising full-year revenue guidance and emphasizing capacity expansion plans to meet unprecedented customer demand while maintaining gross margin expectations despite significant hiring and operational scaling.

Key Financial Results

  • Total net sales of €8.8 billion in Q1 2026, within guidance.
  • Net system sales of €6.3 billion, comprising €4.1 billion from EUV systems (including two High NA systems) and €2.1 billion from non-EUV systems.
  • Installed base management sales of €2.5 billion, slightly above guidance.
  • Gross margin of 53% at the high end of guidance, primarily driven by high-margin components in installed base business.
  • Net income of €2.8 billion, representing 31.4% of total net sales, with earnings per share of €7.15.
  • Operating expenses in line with guidance, with R&D expenses of €1.2 billion and SG&A expenses of €0.3 billion.
  • Effective tax rate of 17.1% for Q1, with expected annualized rate of approximately 17% for full year 2026.
  • Cash, cash equivalents and short-term investments of €8.4 billion at quarter end.
  • Negative free cash flow of €2.6 billion in Q1, largely driven by timing of down payments.
  • Business Segment Results

  • Net system sales split nearly equally between logic at 49% and memory at 51%.
  • EUV revenue expected to increase significantly this year, driven by advanced logic and DRAM market dynamics.
  • Non-EUV revenue expected to grow from previous expectations of flat performance, due to continued customer demand for deep UV lithography supporting expansion plans.
  • Installed base management revenue expected to grow significantly, driven by service revenue from expanding EUV installed base and customer demand for performance upgrades.
  • Capital Allocation

  • Dividend of €1.60 per ordinary share paid as third interim dividend over 2025.
  • Total dividend for 2025 of €7.50 per ordinary share, representing a 17% increase compared to 2024.
  • Final dividend proposal of €2.70 per ordinary share to the annual general meeting.
  • Share repurchases of approximately €1.1 billion in Q1 2026.
  • Industry Trends and Dynamics

  • AI-driven infrastructure investment is the primary growth driver for the semiconductor industry, increasing demand for advanced logic and memory chips.
  • Demand continues to outpace supply for the foreseeable future, creating constraints across end markets from AI to mobile and PCs.
  • Memory customers report being sold out for the remainder of the year, with supply limitations expected to persist beyond 2026 despite significant capacity additions.
  • Logic customers adding capacity across multiple advanced nodes to support demand, while continuing to ramp the 2-nanometer node for next-generation HPC and mobile applications.
  • Supply limitations expected across advanced nodes beyond 2026 in the logic business.
  • Both memory and logic customers increasing capital expenditures and accelerating capacity expansion plans, supported by long-term agreements with their own customers.
  • Continued adoption of EUV and immersion deep UV on new process nodes further increases demand for lithography.
  • DRAM has experienced major adoption of EUV in 2025, with US DRAM customers also shifting strongly toward EUV for performance and capacity benefits.
  • EUV adoption in DRAM reduces multi-patterning requirements, which also saves fab space and improves capacity efficiency.
  • Competitive Landscape

  • Foundry market characterized by huge demand outweighing supply, leaving room for players beyond the market leader.
  • Samsung expanding foundry capacity in Taylor with real plans requiring ASML shipments.
  • US foundry player already has significant capacity, so limited shipments expected from this player in 2026.
  • Multiple players in foundry market will guarantee more innovation, which is beneficial for the ecosystem.
  • Macroeconomic Environment

  • Export control discussions ongoing, with 2026 guidance bandwidth accommodating potential outcomes.
  • China business expected to remain at approximately 20% of total business at midpoint, with this view unchanged.
  • Immersion growth coming primarily from non-China customers, as China remains at expected 20% level.
  • Growth Opportunities and Strategies

  • Low NA EUV productivity roadmap improvements enabling at least 330 wafers per hour at the start of the next decade, supported by 1,000-watt source demonstration.
  • NXE:3800E system upgrade providing 10 wafers per hour increase, with 230 wafers per hour available immediately to all customers.
  • NXE:3800F system raising wafer per hour specification from 250 to 260 wafers per hour, with shipments starting in 2027 and full volume in 2028.
  • High NA platform has processed over 0.5 million wafers and achieved over 80% availability.
  • High NA can replace complex multi-patterning processes, with single High NA exposure replacing three or four Low NA exposures for some use cases.
  • High NA can reduce process steps by a factor of 10 for some critical layers.
  • High NA targeting line pitches of 18 nanometer for logic and contact pitches below 28 nanometer for DRAM.
  • High NA can support single exposure for at least three nodes in logic and DRAM.
  • Customers testing High NA on product wafers and moving closer to high-volume manufacturing.
  • 3D integration becoming important for customer density delivery, with ASML creating activities to support customers in this area.
  • Wafer-to-wafer bonding adoption by DRAM and logic customers, where ASML's lithography and metrology products can help customers adopt new technology.
  • Advanced packaging entry with XT:260 tool showing good traction.
  • Hybrid bonding discussions ongoing with customers for potential future support.
  • Productivity upgrades for installed base allowing customers to get capacity immediately through software switches and qualification.
  • Supply chain preparation enabling capability of 90 Low NA systems and 600 total deep UV systems.
  • Zeiss optics supply chain improvements with much better positioning than in previous ramps.
  • ASML facility capacity expansion supporting increased manufacturing of EUV and deep UV tools.
  • NXE:3800E tool maturity improvements enabling progress on cycle time in manufacturing.
  • Financial Guidance and Outlook

  • 2026 total net sales guidance of €36 billion to €40 billion, narrowed and increased from previous guidance.
  • Gross margin guidance of 51% to 53% maintained for full year 2026, with revenue weighted to second half of the year.
  • Q2 2026 total net sales expected between €8.4 billion and €9 billion.
  • Q2 2026 installed base management sales expected around €2.5 billion.
  • Q2 2026 gross margin expected between 51% and 52%.
  • Q2 2026 R&D expenses expected around €1.2 billion and SG&A around €0.3 billion.
  • At least 60 Low NA EUV systems planned for 2026 output.
  • Immersion system output close to 2025 levels despite slow start.
  • At least 80 Low NA EUV systems planned for 2027, with move rates increasing quarter-by-quarter.
  • Deep UV and application products scaling in alignment with EUV capacity increases.
  • ASML expected to grow in 2026.
  • EUV revenue expected to raise significantly this year.
  • 2027 EUV tool mix expected to be primarily E models with some F models, but hardly any D models.
  • Average selling prices (ASP) expected to improve in 2027 due to more favorable product mix compared to 2026.
  • Customers providing high visibility on expansion plans for 2026 and beyond.
  • Significant fab scale being built by customers allowing for substantial expansion capacity.
  • ASML not expecting to be a bottleneck for customer capacity needs.
  • Long lead time items secured providing flexibility for future capacity expansion.
  • EUV capacity more than doubled from 2025 to 2027 with at least 80 systems.